Thickness optimization of underlayer and seed layer for spin valves
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چکیده
منابع مشابه
Determination of the Copper Layer Thickness in Spin Valves by Grazing Incidence X-ray Fluorescence
We show that at the standard laboratory wavelength of CuKa the scattering factors of Cu and NiosFeo2 are identical, thereby making it impossible to distinguish the boundary of the Cu spacer layer in a Cdpermalloy spin valve structure from grazing incidence x-ray reflectivity curves. Use of grazing incidence fluorescence, in conjunction with x-ray reflectivity provides sufficient information to ...
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Damascene Cu electroplating for on-chip metallization, which we conceived and developed in the early 199Os, has been central to IBM's Cu chip interconnection technology. We review here the challenges of filling trenches and vias with Cu without creating a void or seam, and the discovery that electrodeposition can be engineered to give filling performance significantly better than that achievabl...
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ژورنال
عنوان ژورنال: Acta Crystallographica Section A Foundations of Crystallography
سال: 2009
ISSN: 0108-7673
DOI: 10.1107/s0108767309095683